Packaging and Assembly Analysis I

Monday, November 10, 2014: 2:50 PM-4:05 PM
310 A (George R. Brown Convention Center )
Session Chair:
Dr. Lihong Cao
2:50 PM
Comparative Study on Decapsulation for Copper and Silver Wire-Bonded Devices
Mr. Francois Kerisit, LAMIPS, CRISMAT – NXP semiconductors - Presto-Engineering Europe laboratory, CNRS-UMR6508; ENSICAEN, UCBN; Dr. Bernadette Domengès, LAMIPS, CRISMAT – NXP semiconductors - Presto-Engineering Europe laboratory, CNRS-UMR6508; ENSICAEN, UCBN; Mr. Michael Obein, Digit Concept
3:15 PM
Laser Focus Depth Adaptation for Decapsulation of Copper Wirebonded Devices
Ms. H. B. Kor, Nanyang Technological University; Dr. Qing Liu, Nanyang Technological University; Ms. Y. W. Siah, Nanyang Technological University; Prof. Chee Lip Gan, Nanyang Technological University
3:40 PM
A Sample Preparation on Decapsulation Methodology for Effective Failure Analysis on Thin Small Leadless (TSLP) Flip Chip Package with Copper Pillar (CuP) Bump Interconnect Technology
Mr. HoonYen Gwee, INFINEON TECHNOLOGIES
See more of: Symposium
<< Previous Session | Next Session >>