Test Circuit Conditioning for Soft Defect Localization
Test Circuit Conditioning for Soft Defect Localization
Wednesday, November 12, 2014
Exhibit Hall B3 (George R. Brown Convention Center )
Summary:
Soft Defect Localization is the third and seldom used method on the LSM tool. This presentation will cover circuit signal conditioning to allow for fast dynamic failure isolation using an LSM laser using voltage levels, supply currents, signal frequency, and even manual input.
Soft Defect Localization is the third and seldom used method on the LSM tool. This presentation will cover circuit signal conditioning to allow for fast dynamic failure isolation using an LSM laser using voltage levels, supply currents, signal frequency, and even manual input.