Posters

Wednesday, November 12, 2014: 1:30 PM-3:30 PM
Exhibit Hall B3 (George R. Brown Convention Center )
Session Chairs:
Dr. Martin Versen and Mr. David Grosjean
Quantitative Analysis of Heterogeneous Materials by SEM/EDS by Use of Rapid Phase Decomposition
Mr. John F. Konopka, Thermo Fisher Scientific
Ex Situ Lift Out of PFIB Prepared Site Specific Specimens
Dr. Lucille A. Giannuzzi, EXpressLO LLC; Dr. Lisa Chan, Tescan USA, Inc.; Dr. Jon M. Hiller, Tescan USA, Inc.
Applications of AFP Nanoprobing for Localization of Implant Related Issues
Mr. Dayanand Nagalingam, GLOBALFOUNDRIES Singapore Pte Ltd; Mr. Tao Xie, GLOBALFOUNDRIES Singapore Pte Ltd; Dr. Alfred C.T. Quah, GLOBALFOUNDRIES Singapore Pte Ltd; Ms. Soh Ping Neo, GLOBALFOUNDRIES Singapore Pte Ltd; Ms. Hui Peng Ng, GLOBALFOUNDRIES Singapore Pte Ltd; Mr. Ghim Boon Ang, GLOBALFOUNDRIES Singapore Pte Ltd; Mr. Kim Hong Yip, GLOBALFOUNDRIES Singapore Pte Ltd; Dr. Z.H. Mai, GLOBALFOUNDRIES Singapore Pte Ltd; J. C. Lam, GLOBALFOUNDRIES Singapore Pte Ltd
Auto-Metrology on TEM Images of FinFET
Dr. Sajal Biring, Materials Analysis Technology Inc.; Dr. C H Chu, Materials Analysis Technology Inc.
Metal Bridge Defects Localization By a Tiny Leakage Between One of Bridged Signals and VDD (GND)
Mr. Chunlei Wu, Freescale Semiconductor (China) Limited
TDR Analysis on Short Transmission Lines
Mr. Nicholas Konkol, Intel Corporation; Mr. Colin Stark, MSECE, Intel Corporation
Continuous Wave 1064nm Laser for Laser Voltage Imaging and Probing Applications
Mr. Venkat Ravikumar, Advanced Micro Devices - Singapore Pte Ltd; S.L. Phoa, Advanced Micro Devices - Singapore Pte Ltd; Prasad Sabbineni, DCG Systems; Dr. Dmitry Skvortsov, DCG Systems
Automatic Emission Spots Identification in Static and Dynamic Imaging by Research of Local Maxima
Mr. Anthony Boscaro, Centre National d'Etudes Spatiales; Dr. Philippe Perdu, Centre National d'Etudes Spatiales (CNES); Sabir Jacquir, LE2I, University of Burgundy; Mr. Samuel Chef, LE2I, University of Burgundy; Mr. Kevin Sanchez, Centre National d'Etudes Spatiales (CNES); Stephane Binczak, LE2I, University of Burgundy
Integrated ESD Robustness through Device Analysis of Ultra-Small Low Voltage Power MOSFETs
Mr. Ian Kearney, Texas Instruments; Mr. Hank Sung, Texas Instruments
To Eliminate Curtain Effect of FIB TEM Samples by a Combination of Sample Dicing and Backside Milling
Dr. Jian-Shing Luo, Inotera Memories, Inc.; Ms. Hsiu-Ting Lee, Inotera Memories, Inc.
Ultra-Low Voltage TRE Measurements from 32 nm SOI CMOS Integrated Circuits
Dr. Andrea Bahgat Shehata, IBM T.J. Watson Research Center; Dr. Franco Stellari, IBM Research; Alan Weger, IBM Research; Dr. Peilin Song, IBM T.J. Watson Research Center; Dr. Vikas Anant, Photon Spot; Kristen Sunter, Massachusetts Institute of Technology; Dr. Karl Berggren, Massachusetts Institute of Technology; Dr. Ted R. Lundquist, DCG Systems, Inc; Dr. Euan Ramsay, DCG Systems, Inc
Development of DPA(Distractive Physical Analysis) for Cu wire device
Mr. Hirofumi Tateyama, Oki Engineering Co., Ltd.
Application of Soft Defect Localization (SDL) for SRAM Soft Failure Debug
Dr. SeungJe Moon, GLOBALFOUNDRIES; Boon Lian Yeoh, GLOBALFOUNDRIES; Dr. SH Goh, GLOBALFOUNDRIES; Shaalini CHITHAMBARAM, GLOBALFOUNDRIES; Dr. Alfred C.T. Quah, GLOBALFOUNDRIES Singapore Pte Ltd; Dr. Jeffrey Lam, GLOBALFOUNDRIES
Applications and Techniques for 2D Picosecond Imaging for Circuit Analysis
Dr. Franco Stellari, IBM Research; Dr. Peilin Song, IBM T.J. Watson Research Center; Mr. Alan J. Weger, IBM T.J. Watson Research Center
Marginal Failure Diagnosed with LADA: Case Studies
Mr. Sukho Lee, Samsung Electronics co. Ltd; Mr. Keonil Kim, Samsung Electronics co. Ltd; Mr. Yunwoo Lee, Samsung Electronics co. Ltd; Mr. Euncheol Lee, Samsung Electronics co. Ltd; Mr. Yojoung Kim, Samsung Electronics co. Ltd; Mr. Izak Kapilevich, DCG Systems
Failure Analysis Methodology on Resistive Open Defects
Dr. Alfred C.T. Quah, GLOBALFOUNDRIES Singapore Pte Ltd; Mr. Ghim Boon Ang, GLOBALFOUNDRIES Singapore Pte Ltd; Mr. Dayanand NAGALINGAM, GLOBALFOUNDRIES Singapore Pte Ltd; Ms. Magdeliza Gunawardana, GLOBALFOUNDRIES Singapore Pte Ltd; Mrs. Ng Hui Peng, GLOBALFOUNDRIES Singapore Pte Ltd; Soh Ping NEO, GLOBALFOUNDRIES Singapore Pte Ltd; Dr. Z.H. Mai, GLOBALFOUNDRIES Singapore Pte Ltd; J. C. Lam, GLOBALFOUNDRIES Singapore Pte Ltd
Safe Decapsulation Techniques Using Viton Caulk
Mr. Kristopher D. Staller, Texas Instruments
Memory Address Verification Using NIR Laser
Mr. Wilson Lee Cheng Hoe, Qualcomm
Static Fault Isolation on The Functional Failure of An Digital IC Device
Dr. Changqing Chen, Globalfoundries Singapore
Characterization and Simulation of a Body Biased Structure in Triple-Well Technology Under Pulsed Photoelectric Laser Stimulation
Mr. Nicolas Borrel, STMicroelectronics; Mr. Clement Champeix, STMicroelectronics; Mrs. Edith Kussener, IM2NP-UMR CNRS 7334 / Aix-Marseille University; Mr. Wenceslas Rahajandraibe, IM2NP-UMR CNRS 7334 / Aix-Marseille University; Mr. Mathieu Lisart, STMicroelectronics; Mr. Jean-Max Dutertre, Ecole Nationale Supérieure des Mines de St-Etienne, CMP-GC; Mr. Alexandre Sarafianos, STMicroelectronics
Advanced Fault Localization Technique on e-Fuse Read Failure
Mr. Hung Chin Chen, United Microelectronics Corporation, Ltd.; Chih Yang Tsai, UMC; Mr. Shih-Yuan Liu, UMC; Mr. Jian-Chang Lin, UMC; Mr. Yu-Pang Chang, UMC
Test Circuit Conditioning for Soft Defect Localization
Mr. Kristopher D. Staller, Texas Instruments
Sample Preparation for High Numerical Aperture Solid Immersion Lens Laser Imaging
Mr. Maozhe Samuel Wei, Advanced Micro Devices (Singapore) Pte Ltd; Mr. Soon Huat Lim, Advanced Micro Devices Pte Ltd
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