Tri-Directional TEM Failure Analysis on Sample Prepared By in-Situ Lift-out FIB and Flipstage

Thursday, November 13, 2014: 11:05 AM
310 A (George R. Brown Convention Center )
Dr. Jie Zhu , GLOBALFOUNDRIES Singapore, Singapore, Singapore
Ms. Elizabeth Sebastian , GLOBALFOUNDRIES Singapore, Singapore, Singapore

Summary:

This paper describes advanced FIB technqiue to prepare sample TEM analysis from 3 perpendicular directions.
See more of: Sample Preparation and Device Deprocessing III
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