Sample Preparation and Device Deprocessing III
Thursday, November 13, 2014: 9:50 AM-11:55 AM
310 A (George R. Brown Convention Center )
Session Chairs:
Mr. Roger Alvis
and
Mr. Bryan Tracy
10:15 AM
Investigation of Protection Layer Materials for Ex-situ 'lift-out' TEM sample Preparation Technique with FIB for 14nm FinFET
Mr. Hua Feng, GLOBALFOUNDRIES Singapore Pte. Ltd;
Mr. G.R. Low, Globalfoundries Singapore Pte. Ltd.;
Mr. P.K. Tan, Globalfoundries Singapore Pte. Ltd.;
Mr. Y.Z. Zhao, Global Foundries;
Mr. H.H. Yap, Global Foundries;
Dr. M. K. Dawood, Globalfoundries Singapore Pte. Ltd.;
Mr. Y. Zhou, Global Foundries;
Dr. Anyan Du, GLOBALFOUNDRIES Singapore;
Dr. Changqing Chen, Globalfoundries Singapore;
H. Tan, Globalfoundries Singapore Pte. Ltd.;
Dr. Yamin Huang, GLOBALFOUNDRIES Singapore Pte Ltd;
Dr. Dandan Wang, GLOBALFOUNDRIES Singapore Pte. Ltd;
Dr. Jeffrey Lam, Globalfoundries Singapore Pte. Ltd.;
Dr. Z.H. Mai, GLOBALFOUNDRIES Singapore Pte Ltd
10:40 AM
Application of Passive Voltage Contrast (PVC) to DualBeam Focused Ion Beam (FIB) Based Sample Preparation for the Scanning/Transmission Electron Microscope (S/TEM)
Mr. Corey Senowitz, Qualcomm Technologies, Inc.;
Ms. Theresa Graupera, Qualcomm Technologies, Inc.;
Mr. Don Lyons, Qualcomm Technologies, Inc.;
Mr. Hieu Nguyen, Qualcomm Technologies, Inc.;
Ms. Ruby Vollrath, Qualcomm Technologies, Inc.;
Dr. Michael DiBattista, Qualcomm Technologies, Inc.
