Optimization of TEM Sample Preparation to Reduce the Overlapping of TEM Images

Thursday, November 13, 2014: 8:50 AM
310 A (George R. Brown Convention Center )
Mrs. Shuqing Duan , Semiconductor Manufacturing International (Shanghai) Corp., Shanghai, China
Liu Chen , Semiconductor Manufacturing International (Shanghai) Corp., Shanghai, China
Dr. Huisheng Yu , Semiconductor Manufacturing International (Shanghai) Corp., Shanghai, China
Ming Li , Semiconductor Manufacturing International (Shanghai) Corp., Shanghai, China
Qihua Zhang , Semiconductor Manufacturing International (Shanghai) Corp., Shanghai, China
Wei-Ting Kary Chien , Semiconductor Manufacturing International (Shanghai) Corp., Shanghai, China

Summary:

This paper reports the optimized Transmission Electron Microscopy (TEM) sample preparation methods with Focus Ion Beam (FIB), which are used to reduce or avoid the overlapping of TEM images.
See more of: Sample Preparation and Device Deprocessing II
See more of: Symposium