Sample Preparation and Device Deprocessing II

Thursday, November 13, 2014: 8:00 AM-9:40 AM
310 A (George R. Brown Convention Center )
Session Chairs:
Mr. Roger Alvis and Mr. Bryan Tracy
8:00 AM
Application of Automated FIB for TEM Sample Preparation in Semiconductor Failure Analysis
Dr. Jie Zhu, GLOBALFOUNDRIES Singapore; Dr. Si Ping Zhao, GLOBALFOUNDRIES Singapore; Mr. Mark Najarian, FEI
8:25 AM
Development of Productive Polishing TEM Sample Preparation Methodology
Dr. Huisheng Yu, Semiconductor Manufacturing International (Shanghai) Corp.; Mrs. Shuqing Duan, Semiconductor Manufacturing International (Shanghai) Corp.; Ming Li, Semiconductor Manufacturing International (Shanghai) Corp.; Qihua Zhang, Semiconductor Manufacturing International (Shanghai) Corp.; Wei-Ting Kary Chien, Semiconductor Manufacturing International (Shanghai) Corp.
8:50 AM
Optimization of TEM Sample Preparation to Reduce the Overlapping of TEM Images
Mrs. Shuqing Duan, Semiconductor Manufacturing International (Shanghai) Corp.; Liu Chen, Semiconductor Manufacturing International (Shanghai) Corp.; Dr. Huisheng Yu, Semiconductor Manufacturing International (Shanghai) Corp.; Ming Li, Semiconductor Manufacturing International (Shanghai) Corp.; Qihua Zhang, Semiconductor Manufacturing International (Shanghai) Corp.; Wei-Ting Kary Chien, Semiconductor Manufacturing International (Shanghai) Corp.
9:15 AM
Delayering on Advanced Process Technologies using FIB
Dr. David Donnet, FEI Company; Mr. Oleg Sidorov, FEI Company; Dr. Chad Rue, FEI Company; Mr. Peter Carleson, FEI Company
9:40 AM
Break
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