Advances in FIB-SEM Analysis of TSV and Solder Bumps - Approaching Higher Precision, Throughput and Comprehensiveness

Tuesday, November 11, 2014: 8:50 AM

310 A (George R. Brown Convention Center )

Dr. Tomas Hrncir , TESCAN Brno, Brno, Czech Republic

Mr. Jiri Dluhos , TESCAN Brno, Brno, Czech Republic

Mr. Lukas Hladik , TESCAN ORSAY HOLDING, Brno, Czech Republic

Mrs. Efrat Moyal , LatticeGear, Beaverton, OR

Mrs. Janet Teshima , LatticeGear, Beaverton, OR

Dr. Jaromir Kopecek , Institute of Physics ASCR, Prague, Czech Republic

See more of: 3D Packages II
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