Feature Based Non-Destructive Fault Isolation in Advanced IC Packages
Feature Based Non-Destructive Fault Isolation in Advanced IC Packages
Tuesday, November 11, 2014: 2:35 PM
310 A (George R. Brown Convention Center )
Summary:
Traditional time domain reflectometry (TDR) techniques employ time-based information to locate faults within packages with minimal references to internal structures. Here, we combine a novel and innovative technique, electro optical terahertz pulse reflectometry (EOTPR), with full 3D DUT modelling to quickly and non-destructively perform a feature-based analysis. We demonstrate fault isolation to an accuracy of 10µm or better with respect to device features in an advanced IC package.
Traditional time domain reflectometry (TDR) techniques employ time-based information to locate faults within packages with minimal references to internal structures. Here, we combine a novel and innovative technique, electro optical terahertz pulse reflectometry (EOTPR), with full 3D DUT modelling to quickly and non-destructively perform a feature-based analysis. We demonstrate fault isolation to an accuracy of 10µm or better with respect to device features in an advanced IC package.