Feature Based Non-Destructive Fault Isolation in Advanced IC Packages
Feature Based Non-Destructive Fault Isolation in Advanced IC Packages
Tuesday, November 11, 2014: 2:35 PM
310 A (George R. Brown Convention Center )
Summary:
Traditional time domain reflectometry (TDR) techniques employ time-based information to locate faults within packages with minimal references to internal structures. Here, we combine a novel and innovative technique, electro optical terahertz pulse reflectometry (EOTPR), with full 3D DUT modelling to quickly and non-destructively perform a feature-based analysis. We demonstrate fault isolation to an accuracy of 10�m or better with respect to device features in an advanced IC package.
Traditional time domain reflectometry (TDR) techniques employ time-based information to locate faults within packages with minimal references to internal structures. Here, we combine a novel and innovative technique, electro optical terahertz pulse reflectometry (EOTPR), with full 3D DUT modelling to quickly and non-destructively perform a feature-based analysis. We demonstrate fault isolation to an accuracy of 10�m or better with respect to device features in an advanced IC package.