Packaging and Assembly Analysis III

Tuesday, November 11, 2014: 2:35 PM-3:50 PM
310 A (George R. Brown Convention Center )
Session Chair:
Dr. Lihong Cao
2:35 PM
Feature Based Non-Destructive Fault Isolation in Advanced IC Packages
Dr. Ka Chung Lee, TearView Limited; Dr. Jesse Alton, TearView Limited; Mr. Martin Igarashi, TearView Limited; Mr. Stephane Barbeau, IBM Microelectronics
3:00 PM
Failure Mechanism Studies and Root Cause Identification of Non-Stick on Pad on Microchip Al Bondpads
Dr. Younan Hua, WinTech Nano-Technology Services Pte. Ltd.
3:25 PM
Failure Localization of Intermittent Short Failures Caused By Vertical Conductive Anodic Filament Formation
Mr. Daniel Nuez, Xilinx
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