Applications and Techniques for 2D Picosecond Imaging for Circuit Analysis
Applications and Techniques for 2D Picosecond Imaging for Circuit Analysis
Wednesday, November 12, 2014
Exhibit Hall B3 (George R. Brown Convention Center )
Summary:
In this paper, we present the latest results obtained with a 2D Picosecond Imaging Circuit Analysis (PICA) camera with enhanced Near InfraRed (NIR) sensitivity for taking 2D Time Resolved Emission (TRE). We will discuss key applications where the time-resolved imaging capability is very effective in reducing the debug time and improving the interpretation of the failure signatures of several VLSI chips. Besides conventional chip diagnostics, specific focus will be dedicated to new areas of applications, such as security and reverse engineering. We will also discuss spectral analysis and other techniques that can be used to extract valuable information from the PICA dataset.
In this paper, we present the latest results obtained with a 2D Picosecond Imaging Circuit Analysis (PICA) camera with enhanced Near InfraRed (NIR) sensitivity for taking 2D Time Resolved Emission (TRE). We will discuss key applications where the time-resolved imaging capability is very effective in reducing the debug time and improving the interpretation of the failure signatures of several VLSI chips. Besides conventional chip diagnostics, specific focus will be dedicated to new areas of applications, such as security and reverse engineering. We will also discuss spectral analysis and other techniques that can be used to extract valuable information from the PICA dataset.