Comparative Study on Decapsulation for Copper and Silver Wire-Bonded Devices
Comparative Study on Decapsulation for Copper and Silver Wire-Bonded Devices
Monday, November 10, 2014: 2:50 PM
310 A (George R. Brown Convention Center )
Summary:
In order to reduce costs and improve the bonding process, copper and now silver have been introduced as an alternative to common bonding wire metals (gold and aluminum), leading to new failure analysis issues and especially decapsulation. This study compares the efficiency of wet and dry chemistries for decapsulation on Cu and Ag-alloy wire based ICs. Though plasma decapsulation is a slow process, it appears a good alternative to wet chemistry opening technique as it allows a progressive control of the opening.
In order to reduce costs and improve the bonding process, copper and now silver have been introduced as an alternative to common bonding wire metals (gold and aluminum), leading to new failure analysis issues and especially decapsulation. This study compares the efficiency of wet and dry chemistries for decapsulation on Cu and Ag-alloy wire based ICs. Though plasma decapsulation is a slow process, it appears a good alternative to wet chemistry opening technique as it allows a progressive control of the opening.