SAM Assisted Contour Milling
SAM Assisted Contour Milling
Tuesday, November 11, 2014: 8:00 AM
310 A (George R. Brown Convention Center )
Summary:
Contour milling by high precision CNC-milling shows the possibility to expose warped package interfaces e.g. the die backside. The needed data about the warpage of the surface of interest is in this case derived from SAM time of flight- measurements. The combination of these two methods solves emerging challenges for decapsulation process.
Contour milling by high precision CNC-milling shows the possibility to expose warped package interfaces e.g. the die backside. The needed data about the warpage of the surface of interest is in this case derived from SAM time of flight- measurements. The combination of these two methods solves emerging challenges for decapsulation process.