Case Studies on Application of 3D Real Time X-ray for Flip Chip C4 Package
Case Studies on Application of 3D Real Time X-ray for Flip Chip C4 Package
Tuesday, November 11, 2014: 11:10 AM
310 A (George R. Brown Convention Center )
Summary:
This article describes how 3D Real Time X-Ray (RTX) technique enhances the capability of package-level failure analysis of a flip-chip package. 3D RTX was successful in detecting different failure signatures. This paper outlined detailed application of 3D RTX with the case studies.
This article describes how 3D Real Time X-Ray (RTX) technique enhances the capability of package-level failure analysis of a flip-chip package. 3D RTX was successful in detecting different failure signatures. This paper outlined detailed application of 3D RTX with the case studies.