Understanding the Cu Void Formation by TEM Failure Analysis

Tuesday, November 11, 2014: 2:35 PM
310 B (George R. Brown Convention Center )
Dr. Binghai Liu , GLOBALFOUNDRIES Singapore, Singapore, Singapore
Dr. Jie Zhu , GLOBALFOUNDRIES Singapore, Singapore, Singapore
Mr. Eddie Er , GLOBALFOUNDRIES Singapore, Singapore, Singapore
Dr. Si Ping Zhao , Globalfoundries Singapore, Singapore, SC, Singapore
Dr. Jeffrey Lam , GLOBALFOUNDRIES, Singapore, Singapore
Dr. Changqing Chen , Globalfoundries Singapore, Singapore, Singapore
Mr. Mark Najarian , FEI, SARATOGA SPRINGS, NY

Summary:

A systematic physical failure analysis for understanding the Cu voiding formation in Cu BEOL by various TEM techniques, including EELS and electron diffraction analysis
See more of: Case Studies and the Failure Analysis Process I
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