40th International Symposium for Testing and Failure Analysis (ISTFA 2014): http://www.asminternational.org/content/Events/istfa/

40th International Symposium for Testing and Failure Analysis (ISTFA 2014)
November 09 - 13, 2014

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Ms. May Yang

Semiconductor Manufacturing International (Beijing) Corp
Analysis Lab
18 Wenchang Avenue
Beijing China 100176

Papers:
Basic Decapsulate Tool Function Develop for Cu Wire Bonding IC and the Real Usage on Function Extended Basic EMMI for Dynamic EFA Identification Failure Mechanism of Threshold Voltage Shift Induced By Dopant Diffuse Via Nano-Probe, Simulation and Wet Stain Techniques

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General Information

November 09 - 13, 2014


Houston, TX