28.1
A Combination Continuous Wave and Pulse Laser Assisted Chemical Etching Processes through Encapsulated IC Packaging
A Combination Continuous Wave and Pulse Laser Assisted Chemical Etching Processes through Encapsulated IC Packaging
Wednesday, November 4, 2015
Exhibit Hall D (Oregon Convention Center )
Summary:
Post silicon validation techniques specifically Focused Ion Beam (FIB) circuit editing require backside sample preparation done by local silicon machining to access the active circuits. Conventional methods such as Laser Chemical Etching (LCE) platforms are commonly used. This paper will investigate and conjoin previously published techniques to this local silicon preparation by using a combination of laser sources to de-process IC packaging materials silicon and mold compound encapsulation.
Post silicon validation techniques specifically Focused Ion Beam (FIB) circuit editing require backside sample preparation done by local silicon machining to access the active circuits. Conventional methods such as Laser Chemical Etching (LCE) platforms are commonly used. This paper will investigate and conjoin previously published techniques to this local silicon preparation by using a combination of laser sources to de-process IC packaging materials silicon and mold compound encapsulation.