28
FIB Circuit Analysis and Edit - Poster

Wednesday, November 4, 2015: 1:30 PM-3:30 PM
Exhibit Hall D (Oregon Convention Center )
Session Chairs:  Mr. Jason M. Benz, BS/MS Microelectronic Eng & Materials Science, GLOBALFOUNDRIES, Essex Jct,, VT and Dr. Michael DiBattista, Qualcomm, Inc., San Diego, CA
28.1
A Combination Continuous Wave and Pulse Laser Assisted Chemical Etching Processes through Encapsulated IC Packaging
Mr. Matthew M. Mulholland, Intel Corporation; Mr. Scott Silverman, Varioscale, Inc
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