41st International Symposium for Testing and Failure Analysis (November 1 - 5, 2015): At-A-Glance
41st International Symposium for Testing and Failure Analysis (November 1 - 5, 2015): At-A-Glance
SUNDAY November 1
Tutorial
AM
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Package and Physical Analysis Challenges8:00 AM-11:30 AM
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Electrical and Yield8:00 AM-2:00 PM
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Fault Isolation8:00 AM-2:30 PM
PM
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Microscopy12:30 PM-5:30 PM
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Technology Specific FA2:00 PM-5:00 PM
MONDAY November 2
Technical Program
AM
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Opening Session8:00 AM-9:10 AM
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Refreshment Break9:10 AM-9:30 AM
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Emerging FA Techniques and Concepts9:30 AM-10:45 AM
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Fault Isolation I10:45 AM-12:00 PM
PM
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Monday Lunch12:00 PM-1:00 PM
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Scanning Probe Analysis1:00 PM-1:50 PM
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FIB Sample Preparation1:00 PM-2:15 PM
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Fault Isolation II1:50 PM-3:30 PM
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FIB Circuit Analysis and Edit2:15 PM-3:30 PM
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Refreshment Break3:30 PM-3:40 PM
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Contactless Fault Isolation User Group3:40 PM-5:40 PM
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FIB User Group3:40 PM-5:40 PM
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Tools of the Trade Tour *Separate Registration Required5:00 PM-6:00 PM
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Off-Site Social Event - Punch Bowl Social7:00 PM-9:30 PM
TUESDAY November 3
Technical Program
AM
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Plenary Session9:00 AM-10:30 AM
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Refreshment Break10:30 AM-11:10 AM
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Board and System Level FA11:10 AM-12:00 PM
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Microscopy11:10 AM-12:00 PM
PM
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Tuesday Lunch12:00 PM-1:30 PM
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Refresh & Energize Break1:30 PM-2:55 PM
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3D Devices Failure Analysis I2:55 PM-4:05 PM
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Detecting Counterfeit Microelectronics I2:55 PM-5:00 PM
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Expo Welcome Reception5:00 PM-6:40 PM
WEDNESDAY November 4
Technical Program
AM
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Metrology and In-line Device Characterization8:00 AM-8:50 AM
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Refreshment Break9:30 AM-10:30 AM
PM
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EDFAS Luncheon and General Membership Meeting12:10 PM-1:30 PM
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3D Devices Failure Analysis - Poster1:30 PM-3:30 PM
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Case Studies and FA Process - Posters1:30 PM-3:30 PM
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Device FA - Posters1:30 PM-3:30 PM
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Emerging FA Techniques and Concepts - Poster1:30 PM-3:30 PM
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FA Lab Management - Posters1:30 PM-3:30 PM
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Fault Isolation - Posters1:30 PM-3:30 PM
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FIB Circuit Analysis and Edit - Poster1:30 PM-3:30 PM
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Metrology and In-line Characterization - Posters1:30 PM-3:30 PM
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Microscopy - Posters1:30 PM-3:30 PM
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Student Posters1:30 PM-3:30 PM
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Packaging and Assembly Level FA - Posters1:30 PM-3:30 PM
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Sample Preparation and Device Deprocessing - Posters1:30 PM-3:30 PM
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Scanning Probe Analysis - Posters1:30 PM-3:30 PM
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Exhibitor Dessert Reception1:30 PM-3:30 PM
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3D Device Failure Analysis II3:30 PM-4:45 PM
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Diagnostic Testing, Scanning and Debug3:30 PM-4:45 PM
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Detecting Counterfeit Microelectronics II4:45 PM-6:00 PM
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Device FA4:45 PM-6:00 PM
Tutorial
AM
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Medical Device Tutorial8:00 AM-9:30 AM
Video Contest
PM
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Video Contest1:30 PM-3:00 PM
THURSDAY November 5
Technical Program
AM
-
Nanoprobing and Electrical Characterization8:00 AM-10:05 AM
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Packaging and Assembly Level FA I9:00 AM-10:15 AM
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Refreshment Break10:05 AM-10:25 AM
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Packaging and Assembly Level FA II10:25 AM-11:40 AM
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Sample Preparation and Device Deprocessing I10:25 AM-11:40 AM
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Thursday Lunch11:40 AM-12:40 PM
PM
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Sample Preparation and Device Deprocessing II12:40 PM-1:55 PM
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Case Studies and FA Process12:40 PM-2:20 PM
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Refreshment Break1:55 PM-2:30 PM
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Sample Prep / 3D Package Prep User Group2:05 PM-4:05 PM
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NanoProbing User Group2:30 PM-4:30 PM
Tutorial
AM
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Package FI Tutorial8:00 AM-9:00 AM