Decapsulation of Multi-Chip BOAC Devices with Exposed Copper Metallization Using Atmospheric Pressure Microwave Induced Plasma

Thursday, November 5, 2015: 1:05 PM
Meeting Room D137 & 138 (Oregon Convention Center )
Dr. J. Tang , JIACO Instruments B.V., Delft, Netherlands
Mr. Kristopher D. Staller , Texas Instruments, Tucson, AZ
Prof. C.I.M. Beenakker , Delft University of Technology, Delft, Netherlands