20
Sample Preparation and Device Deprocessing II

Thursday, November 5, 2015: 12:40 PM-1:55 PM
Meeting Room D137 & 138 (Oregon Convention Center )
Session Chairs:  Mr. Jake E. Klein, Quality, Texas Instruments, Tucson, AZ and Mr. Roger Alvis, FEI Company, Hillsboro, OR
12:40 PM
20.1
LASER combined with Plasma will it be the future green and safe ICs decapsulation method?
Mr. p poirier, DIGIT CONCEPT SA; Mr. Michael Obein, Digit Concept
1:05 PM
20.2
Decapsulation of Multi-Chip BOAC Devices with Exposed Copper Metallization Using Atmospheric Pressure Microwave Induced Plasma
Dr. J. Tang, JIACO Instruments B.V.; Mr. Kristopher D. Staller, Texas Instruments; Prof. C.I.M. Beenakker, Delft University of Technology
1:30 PM
20.3
Repeatable method for automated decapsulation of silver alloy wire packages
Dr. MATTHEW J. Lefevre, JP Kummer; Mr. Emmanuel Noraz, ST Microelectronics; Dr. Damien Veychard, ST Microelectronics
1:55 PM
Break
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