9.2
Fast Feature Based Non-Destructive Fault Isolation in 3D IC Packages Utilizing Virtual Known Good Device

Tuesday, November 3, 2015: 3:20 PM
Meeting Room D139 & 140 (Oregon Convention Center )
Dr. Ka Chung Lee , TeraView Limited, Cambridge, United Kingdom
Dr. Jesse Alton , TeraView Limited, Cambridge, United Kingdom
Mr. Martin Igarashi , TeraView Limited, Cambridge, United Kingdom
Mr. Stephane Barbeau , IBM Microelectronics, Bromont, QC, Canada

See more of: 3D Devices Failure Analysis I
See more of: Technical Program