9
3D Devices Failure Analysis I

Tuesday, November 3, 2015: 2:55 PM-4:05 PM
Meeting Room D139 & 140 (Oregon Convention Center )
Session Chairs:  Mr. Frank Altmann, Center for Applied Microstructure Diagnostics (CAM), Fraunhofer Institute for Mechanics of Materials, Halle, Germany and Dr. Yan Li, Intel, Chandler, AZ
2:55 PM
9.1
Failure and stress analysis of Cu TSVs using GHz-scanning acoustic microscopy and polariscopy
Prof. Ingrid De Wolf, KU Leuven; Mr. Ahmad Khaled, IMEC; Dr. Martin Herms, PVA Metrology and Plasma Solutions GmbH; Dr. Matthias Wagner, PVA Metrology and Plasma Solutions GmbH; Dr. Tatjana Djuric, PVA Tepla Analytical Systems GmbH; Dr. Peter Czurratis, PVA Tepla Analytical Systems GmbH; Dr. Sebastian Brand, Fraunhofer Institute of Material Mechanics
3:20 PM
9.2
Fast Feature Based Non-Destructive Fault Isolation in 3D IC Packages Utilizing Virtual Known Good Device
Dr. Ka Chung Lee, TeraView Limited; Dr. Jesse Alton, TeraView Limited; Mr. Martin Igarashi, TeraView Limited; Mr. Stephane Barbeau, IBM Microelectronics
3:45 PM
9.3
Failure analysis strategies for multi-stacked memory devices with TSV interconnects
Mr. Frank Altmann, Fraunhofer Institute for Mechanics of Materials; Mr. Christian Grosse, Fraunhofer Institute for Mechanics of Materials; Mr. Falk Naumann, Fraunhofer Institute for Mechanics of Materials; Mr. Jens Beyersdorfer, Fraunhofer Institute for Mechanics of Materials; Mr. Tony Veches, Micron Technology, Inc.
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