33.3
A More Rapid Approach in Revealing the Physical Status of Polyfuses and Thin Film Fuses in a Multi-Layer Integrated Circuit
A More Rapid Approach in Revealing the Physical Status of Polyfuses and Thin Film Fuses in a Multi-Layer Integrated Circuit
Wednesday, November 4, 2015
Exhibit Hall D (Oregon Convention Center )
Summary:
This paper aims to discuss the processes involved in establishing a more rapid approach in exposing the polyfuse and thin film fuse using the reactive ion etching, chemical deprocessing and parallel lapping techniques. The results proved that parallel lapping technique in combination with chemical deprocessing and reactive ion etching is a faster approach in exposing the physical status of the fuses.
This paper aims to discuss the processes involved in establishing a more rapid approach in exposing the polyfuse and thin film fuse using the reactive ion etching, chemical deprocessing and parallel lapping techniques. The results proved that parallel lapping technique in combination with chemical deprocessing and reactive ion etching is a faster approach in exposing the physical status of the fuses.