19.2
Adaptive Grinding and Polishing of Silicon Integrated Circuits to Ultrathin Remaining Thickness

Thursday, November 5, 2015: 10:50 AM
Meeting Room D139 & 140 (Oregon Convention Center )
Dr. Robert D. Chivas , Varioscale, Inc, San Marcos, CA
Mr. Scott Silverman , Varioscale, Inc, San Marcos, CA
Dr. Michael DiBattista , Qualcomm, Inc., San Diego, CA

See more of: Sample Preparation and Device Deprocessing I
See more of: Technical Program