Non-destructive PCB Reverse Engineering Using X-ray Micro Computed Tomography

Tuesday, November 3, 2015: 3:45 PM
Meeting Room D137 & 138 (Oregon Convention Center )
Dr. Navid Asadizanjani , University of Florida, Gainesville, FL
Dr. Sina Shahbazmohamadi, PhD , Manhattan College, Riverdale, NY
Prof. Mark Tehranipoor, PhD , University of Florida, Gainesville, FL
Prof. Domenic Forte, PhD , University of Florida, Gainesville, FL


Reverse engineering is traditionally considered as a destructive method for variety of applications. X-ray tomography is an advanced imaging technique to do non-destructive three dimensional (3D) imaging. In this paper this technique has been utilized to raise the community awareness of the state-of-the-art capabilities available for attackers for reverse engineer different types of integrated circuits and in particular printed circuit boards (PCBs). A Zeiss Versa 510 machine is used to extract internal information of a four layers custom designed board in order to provide a proof of concept and in the next level the same procedure is applied for Xilinx Spartan-3 starter board, which is a complex commercial system. This work should be of interest to both government and industry that need to protect their captured military systems and intellectual property from foreign enemies and counterfeiters who possess these advanced capabilities.