17.3
X-ray Microscopy and Root Cause Analysis in Electronic Packaging

Thursday, November 5, 2015: 9:50 AM
Meeting Room D137 & 138 (Oregon Convention Center )
Dr. Laura Mirkarimi , Carl Zeiss X-ray Microscopy, Pleasanton, CA
Dr. Allen Gu , Carl Zeiss X-ray Microscopy, Pleasanton, CA
Mr. Gabe Guevara , Invensas Corporation, San Jose, CA
Dr. Rajesh Katkar , Invensas Corporation, San Jose, CA
Long Huynh , Invensas Corporation, San Jose, CA
Mr. Luke Hunter , Carl Zeiss X-ray Microscopy, Pleasanton, CA

Summary:

Root cause analysis is enhanced with a more comprehensive tool set. Environmental testing performed in conjunction with electrical test and non-destructive X-ray microscopy enables improved root cause analysis and more careful screening for Tzero failures.
See more of: Packaging and Assembly Level FA I
See more of: Technical Program