17
Packaging and Assembly Level FA I

Thursday, November 5, 2015: 9:00 AM-10:15 AM
Meeting Room D137 & 138 (Oregon Convention Center )
Session Chairs:  Dr. Lihong Cao, Quality & Reliability Engineering, Advanced Micro Devices, Austin, TX and Mr. Bhanu P. Sood, Mechanical Engineering, CALCE, University of Maryland, College Park, MD
9:00 AM
17.1
Corrosion Mechanisms of Cu Bond Wires on AlSi Pads
Dr. Wentao Qin, ON Semiconductor; Dr. Harold Anderson, ON Semiconductor; Dr. Tom Anderson, ON Semiconductor; Dr. George Chang, ON Semiconductor; Ms. Denise Barrientos, ON Semiconductor
9:25 AM
17.2
Failure Modes Associated with Plastic Packages and Cu Bond Wires
Mr. Sultan Lilani, Analytical Solutions
9:50 AM
17.3
X-ray Microscopy and Root Cause Analysis in Electronic Packaging
Dr. Laura Mirkarimi, Carl Zeiss X-ray Microscopy; Dr. Allen Gu, Carl Zeiss X-ray Microscopy; Mr. Gabe Guevara, Invensas Corporation; Dr. Rajesh Katkar, Invensas Corporation; Long Huynh, Invensas Corporation; Mr. Luke Hunter, Carl Zeiss X-ray Microscopy
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