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Packaging and Assembly Level FA - Posters
Packaging and Assembly Level FA - Posters
Wednesday, November 4, 2015: 1:30 PM-3:30 PM
Exhibit Hall D (Oregon Convention Center )
Session Chairs: Dr. Lihong Cao, Quality & Reliability Engineering, Advanced Micro Devices, Austin, TX and Mr. Bhanu P. Sood, Mechanical Engineering, CALCE, University of Maryland, College Park, MD
See more of: Technical Program