Sample Preparation Challenges in Removing Copper Pillar WLCSP Device Embedded in PCB Module for Electrical Testing and Failure Analysis
Sample Preparation Challenges in Removing Copper Pillar WLCSP Device Embedded in PCB Module for Electrical Testing and Failure Analysis
Wednesday, November 9, 2016
Summary:
The established sample preparations technique enable ATE testing, electrical evaluations and failure analysis performs on copper pillars CSP device embedded in PCB module. This technique solves the problems facing by test, product and characterization engineers in performing ATE testing and electrical evaluation on a singulated CSP device embedded in PCB module. Furthermore, failure analysis engineers can apply this technique to perform FA on fail samples returns from both internal and external customers.
The established sample preparations technique enable ATE testing, electrical evaluations and failure analysis performs on copper pillars CSP device embedded in PCB module. This technique solves the problems facing by test, product and characterization engineers in performing ATE testing and electrical evaluation on a singulated CSP device embedded in PCB module. Furthermore, failure analysis engineers can apply this technique to perform FA on fail samples returns from both internal and external customers.