Sample Preparation and Device Deprocessing - Poster
Wednesday, November 9, 2016: 1:30 PM-3:30 PM
Chairs: Dr. Zhigang Song, Globalfoundries, Hopewell Junction, NY
Co-chairs: Dr. Erwin Hendarto, LatticeGear, Beaverton, OR
Decapsulation of IC Package by Atmospheric Microwave Plasma Needle
Dr. Martin Kral, Nippon Scientific Co., Ltd.;
Dr. Masashi Kando, Plasma Applications Co., Ltd.;
Dr. Marius Gabriel blajan, Plasma Applications Co., Ltd.;
Mr. Yoichi Tsujita, Nippon Scientific Co., Ltd.;
Mr. Satoshi Suzuki, Nippon Scientific Co., Ltd.;
Mr. Yasutoshi Yamaichi, Nippon Scientific Co., Ltd.;
Mr. Naoto Ohta, Nippon Scientific Co., Ltd.
MEMS Failure Analysis In Wafer Fabrication
Ms. Ng Hui Peng, GLOBALFOUNDRIES Singapore Pte Ltd;
Mr. Ang Ghim Boon, GLOBALFOUNDRIES Singapore Pte Ltd;
Ms. Angela Teo, GLOBALFOUNDRIES Singapore Pte Ltd;
Quah Alfred, GLOBALFOUNDRIES Singapore Pte Ltd;
Mr. Dayanand Nagalingam, GLOBALFOUNDRIES Singapore Pte Ltd;
Dr. Xu Nai Yun, GLOBALFOUNDRIES Singapore Pte Ltd;
Dr. Chen Changqing, GLOBALFOUNDRIES Singapore Pte Ltd;
Dr. Mai Zhi Hong, GLOBALFOUNDRIES Singapore Pte Ltd;
Dr. Jeffrey C. Lam, GLOBALFOUNDRIES Singapore Pte Ltd