Sample Preparation and Device Deprocessing  - Poster
	 
					
	
	Wednesday, November 9, 2016: 1:30 PM-3:30 PM
	
	
	
	
	
	Chairs:  Dr. Zhigang Song, Globalfoundries, Hopewell Junction, NY 
Co-chairs:  Dr. Erwin Hendarto, LatticeGear, Beaverton, OR 
 		
	
	
	
		
	
	
	
	
	
	
	
	
	
		Decapsulation of IC Package by Atmospheric Microwave Plasma Needle
		
			
				Dr. Martin Kral, Nippon Scientific Co., Ltd.; 
			
				Dr. Masashi Kando, Plasma Applications Co., Ltd.; 
			
				Dr. Marius Gabriel blajan, Plasma Applications Co., Ltd.; 
			
				Mr. Yoichi Tsujita, Nippon Scientific Co., Ltd.; 
			
				Mr. Satoshi Suzuki, Nippon Scientific Co., Ltd.; 
			
				Mr. Yasutoshi Yamaichi, Nippon Scientific Co., Ltd.; 
			
				Mr. Naoto Ohta, Nippon Scientific Co., Ltd.
			
		
		
			
		
	 
 
	
	
	
	
		MEMS Failure Analysis In Wafer Fabrication
		
			
				Ms. Ng Hui Peng, GLOBALFOUNDRIES Singapore Pte Ltd; 
			
				Mr. Ang Ghim Boon, GLOBALFOUNDRIES Singapore Pte Ltd; 
			
				Ms. Angela Teo, GLOBALFOUNDRIES Singapore Pte Ltd; 
			
				Quah Alfred, GLOBALFOUNDRIES Singapore Pte Ltd; 
			
				Mr. Dayanand Nagalingam, GLOBALFOUNDRIES Singapore Pte Ltd; 
			
				Dr. Xu Nai Yun, GLOBALFOUNDRIES Singapore Pte Ltd; 
			
				Dr. Chen Changqing, GLOBALFOUNDRIES Singapore Pte Ltd; 
			
				Dr. Mai Zhi Hong, GLOBALFOUNDRIES Singapore Pte Ltd; 
			
				Dr. Jeffrey C. Lam, GLOBALFOUNDRIES Singapore Pte Ltd