42nd International Symposium for Testing and Failure Analysis (November 6-10, 2016)
November 06 - 10, 2016
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Electrical failures due to particle induced copper wire bond corrosion
Thursday, November 10, 2016: 10:15 AM
110AB (Fort Worth Convention Center)
Mr. WF Kho
,
NXP Semiconductors Malaysia Sdn Bhd, Petaling Jaya, Malaysia
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Packaging and Assembly Level FA
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Technical Program