Packaging and Assembly Level FA

Thursday, November 10, 2016: 9:50 AM-11:55 AM
110AB (Fort Worth Convention Center)
Chairs:  Mr. Bhanu P. Sood, Mechanical Engineering, NASA Goddard Space Flight Center, Greenbelt, MD
Co-chairs:  Ms. Becky Holdford, Consultant, Garland, TX
9:50 AM
Non-destructive visualizations of short circuits in ball grid arrays by magnetic field imaging and three-dimensional X-ray microscopy
Dr. Kazuhiro Suzuki, Toshiba Nanoanalysis Corporation; Masayoshi Tsutsumi, Toshiba Nanoanalysis Corporation; Masako Saito, Toshiba Nanoanalysis Corporation; Makoto Toda, Toshiba Nanoanalysis Corporation; Kouzou Yamamoto, Toshiba Nanoanalysis Corporation; Yuji Terui, Toshiba Nanoanalysis Corporation
10:15 AM
Electrical failures due to particle induced copper wire bond corrosion
Mr. WF Kho, NXP Semiconductors Malaysia Sdn Bhd
10:40 AM
Mechanism to Improve the Reliability of Cu Wire Bonding by Pd-Coating of the Wire
Dr. Wentao Qin, ON Semiconductor; Dr. Tom Anderson, ON Semiconductor; Dr. George Chang, ON Semiconductor; Dr. Harold Anderson, ON Semiconductor; Ms. Denise Barrientos, ON Semiconductor
11:05 AM
Effects of barrier metal and etch profile on galvanic corrosion of Al pad
Mr. sang Bae Youn, Manufacturing and Technology, SK Hynix
11:30 AM
INVITED TALK: Downhole-Environment Wirebond Failure Analysis
Mr. John Bescup, Weatherford Drilling Services
11:55 AM
How to achieve artefact-free FIB milling on polyimide packages
Dr. Tomas Hrncir, TESCAN Brno s.r.o.; Mr. Marek Sikula, TESCAN Brno s.r.o.; Mr. Pascal Gounet, STMicroelectronics; Dr. Jozef Vincenc Obona, TESCAN Brno s.r.o.
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