42nd International Symposium for Testing and Failure Analysis (November 6-10, 2016)
November 06 - 10, 2016
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Signature Analysis of Device Failure Mechanisms on 2.5D Package IC Devices
Wednesday, November 9, 2016
Mr. Daniel Nuez
,
Xilinx, San Jose, CA
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3D Devices Failure Analysis - Poster
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Technical Program