3D Devices Failure Analysis - Poster

Wednesday, November 9, 2016: 1:30 PM-3:30 PM
Chairs:  Mr. Frank Altmann, Center for Applied Microstructure Diagnostics (CAM), Fraunhofer Institute for Mechanics of Materials, Halle, Germany
Co-chairs:  Ms. Claudia Keller, Infineon, Munich, Germany
Signature Analysis of Device Failure Mechanisms on 2.5D Package IC Devices
Mr. Daniel Nuez, Xilinx
See more of: Technical Program
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