42nd International Symposium for Testing and Failure Analysis (November 6-10, 2016)
November 06 - 10, 2016
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Physical analysis approach to investigate copper solderable front side discoloration issue
Wednesday, November 9, 2016
Ms. Saw Sing Lim
,
Infineon Technology (Kulim) Sdn. Bhd., Kulim Hi-Tech Park, Malaysia
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Microscopy - Poster
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