42nd International Symposium for Testing and Failure Analysis (November 6-10, 2016)
November 06 - 10, 2016
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Non-wetting effects of Si contamination on Cu bumps of a flip chip package: A Case Study
Wednesday, November 9, 2016
Ms. Janella Mae R. Salamania, M.Sc., M. Eng.
,
ams AG, Premstaetten, Austria
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Packaging and Assembly Level FA - Poster
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Technical Program