Packaging and Assembly Level FA - Poster

Wednesday, November 9, 2016: 1:30 PM-3:30 PM
Chairs:  Mr. Bhanu P. Sood, Mechanical Engineering, NASA Goddard Space Flight Center, Greenbelt, MD
Co-chairs:  Ms. Becky Holdford, DDAO SCP Advanced PFA, Texas Instruments, Inc., Dallas, TX
Non-wetting effects of Si contamination on Cu bumps of a flip chip package: A Case Study
Ms. Janella Mae R. Salamania, M.Sc., M. Eng., ams AG
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