How to achieve artefact-free FIB milling on polyimide packages

Thursday, November 10, 2016: 11:55 AM
110AB (Fort Worth Convention Center)
Dr. Tomas Hrncir , TESCAN Brno s.r.o., Brno, Czech Republic
Mr. Marek Sikula , TESCAN Brno s.r.o., Brno, Czech Republic
Mr. Pascal Gounet , STMicroelectronics, Grenoble, France
Dr. Jozef Vincenc Obona , TESCAN Brno s.r.o., Brno, Czech Republic

Summary:

We will demonstrate the fast and artifact-free plasma FIB milling of polymide packages. FIB artefacts from the polyimide package material were removed by utilizing the novel method for FIB spot sharpening.
See more of: Packaging and Assembly Level FA
See more of: Technical Program