Failure Analysis Case Study of Inductively Coupled Cross-Chip Signals
Failure Analysis Case Study of Inductively Coupled Cross-Chip Signals
Monday, November 7, 2016: 3:15 PM
108 (Fort Worth Convention Center)
Summary:
This paper discusses a failure analysis case study in a highly integrated mixed signal device caused by inductive coupling of on-chip signals. The techniques utilized and approach to identifying root cause are discussed in depth. The interactions between the device design and failure mechanism are identified in detail. Heavy focus centers on drawing conclusions from the sum of individual data points, and providing an analytical path by which similar failures can be isolated and specific device sensitivities can be identified.
This paper discusses a failure analysis case study in a highly integrated mixed signal device caused by inductive coupling of on-chip signals. The techniques utilized and approach to identifying root cause are discussed in depth. The interactions between the device design and failure mechanism are identified in detail. Heavy focus centers on drawing conclusions from the sum of individual data points, and providing an analytical path by which similar failures can be isolated and specific device sensitivities can be identified.