Case Studies and FA Process I

Monday, November 7, 2016: 2:25 PM-3:40 PM
108 (Fort Worth Convention Center)
Chairs:  Dr. Yan Li, Intel, Chandler, AZ
Co-chairs:  Mr. Apek Mulay, Mulay's Consultancy Services, Tustin, CA and Ms. Jaya Chowdhury, Chem Trace, Fremont, CA
2:25 PM
Failure Analysis Methodology on Systematic Polar failing pattern due to higher Solder Bump Resistance issue in RF SOI device
Mr. Ang Ghim Boon, GLOBALFOUNDRIES Singapore Pte Ltd; Dr. Changqing Chen, Globalfoundries Singapore; Ng Hui Peng, GLOBALFOUNDRIES Singapore Pte Ltd; Quah Alfred, GLOBALFOUNDRIES Singapore Pte Ltd; Mr. Dayanand Nagalingam, GLOBALFOUNDRIES Singapore Pte Ltd; Ms. Angela Teo, GLOBALFOUNDRIES Singapore Pte Ltd; Teo Hanwei, GLOBALFOUNDRIES Singapore Pte Ltd; Mai Zhihong, GLOBALFOUNDRIES Singapore Pte Ltd; Dr. Jeffrey C. Lam, GLOBALFOUNDRIES Singapore Pte Ltd
2:50 PM
Root Cause Analysis for Pin Leakage
Dr. Zhigang Song, Globalfoundries; Mr. Jocho Nxumalo, Globalfoundries; Manuel Villalobos, Globalfoundries; Ms. Sweta Pendyala, Globalfoundries
3:15 PM
Failure Analysis Case Study of Inductively Coupled Cross-Chip Signals
Mr. Steven J. Loveless, Texas Instruments; Ms. Zhihong You, Texas Instruments; Dr. Tathagata Chatterjee, Texas Instruments; Mr. Badarish Subbannavar, Texas Instruments
See more of: Technical Program
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