Visible Light Probing Sample Thinning using Targeted Lapping
Visible Light Probing Sample Thinning using Targeted Lapping
Monday, November 7, 2016: 1:25 PM
108 (Fort Worth Convention Center)
Summary:
Visible light probing requires ultrathinning of the silicon backside. We present a simple technique to ultrathin a DUT at a targeted location by taking advantage of the intrinsic bowing of a packaged die. A custom fixture is used to accurately align the target area. Besides the advantages of low cost, the technique offers high yield, superior surface quality and better thermal control compared to contour milling.
Visible light probing requires ultrathinning of the silicon backside. We present a simple technique to ultrathin a DUT at a targeted location by taking advantage of the intrinsic bowing of a packaged die. A custom fixture is used to accurately align the target area. Besides the advantages of low cost, the technique offers high yield, superior surface quality and better thermal control compared to contour milling.