Visible Light Probing Sample Thinning using Targeted Lapping

Monday, November 7, 2016: 1:25 PM
108 (Fort Worth Convention Center)
Dr. Rudolf Schlangen , NVIDIA, Santa Clara, CA
Dr. William Lo , NVIDIA, Santa Clara, CA
Dr. Yuanjing (Jane) Li , NVIDIA, Santa Clara, CA
Elia Halteh , NVIDIA, Santa Clara, CA
John Aguada , nVIDIA Corporation, Santa Clara, CA
Jessica Yang , NVIDIA, Santa Clara, CA
Howard Lee Marks , NVIDIA, Santa Clara, CA

Summary:

Visible light probing requires ultrathinning of the silicon backside. We present a simple technique to ultrathin a DUT at a targeted location by taking advantage of the intrinsic bowing of a packaged die. A custom fixture is used to accurately align the target area. Besides the advantages of low cost, the technique offers high yield, superior surface quality and better thermal control compared to contour milling.