Sample Preparation and Device Deprocessing

Monday, November 7, 2016: 12:35 PM-2:15 PM
108 (Fort Worth Convention Center)
Chairs:  Dr. Zhigang Song, IBM, Hopewell Junction, NY
Co-chairs:  Dr. Erwin Hendarto, Silicon Labs, Austin, TX
12:35 PM
Sample chemical staining and latest generation SEM imaging – Characterizing process robustness in semiconductor manufacturing
Dr. Andreas Meyer, Globalfoundries Fab 1; Dr. Eckhard Langer, Globalfoundries Fab 1
1:00 PM
CF4-free Microwave Induced Plasma Decapsulation of Automotive Semiconductor Devices
Dr. Jiaqi Tang, JIACO Instruments B.V.; Mr. G. B. Anderson, Infineon Technologies; Ms. Jing Wang, JIACO Instruments B.V.; Johannes Bruckmeier, Infineon Technologies Munich; Ms. Claudia Keller, Infineon Technologies Munich; Genny V. Dela Cruz, Infineon Technologies Singapore; Prof. Kees Beenakker, Delft University of Technology
1:25 PM
Visible Light Probing Sample Thinning using Targeted Lapping
Dr. Rudolf Schlangen, NVIDIA; Dr. William Lo, NVIDIA; Dr. Yuanjing (Jane) Li, NVIDIA; Elia Halteh, NVIDIA; John Aguada, nVIDIA Corporation; Jessica Yang, NVIDIA; Howard Lee Marks, NVIDIA
1:50 PM
Electrical Invasiveness of Grinding and Polishing Advanced Silicon Integrated Circuits to Ultra-thin Remaining Silicon Thickness
Dr. Robert D. Chivas, Varioscale, Inc; Mr. Scott Silverman, Varioscale, Inc; Dr. Ulrike Kindereit, Qualcomm Technologies, Inc; Dr. Michael DiBattista, Qualcomm Technologies, Inc
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