A New Methodology to Protect PCBs from Non-destructive Reverse Engineering
A New Methodology to Protect PCBs from Non-destructive Reverse Engineering
Tuesday, November 8, 2016: 4:35 PM
110AB (Fort Worth Convention Center)
Summary:
Reverse engineering has been performed for two main reasons: honest ones such as failure analysis, fault isolation, trustworthiness verification, etc. to dishonest ones such as cloning, counterfeiting, development of attacks, etc. Destructive methods on PCBs were considered the most common technique,, but the advent of advanced characterization and imaging tools such as X-ray tomography has shifted the reverse engineering toward non-destructive reverse engineering. Such technique considerably lowers the associated time and cost to reverse engineer a PCB. Therefore, here we introduce a new Anti-reverse engineering method to protect PCBs from non-destructive reverse engineering. We will use advanced algorithms to print or implement high Z materials inside PCBs, which creates inevitable imaging artifacts during tomography and makes it almost impossible to extract the correct information.
Reverse engineering has been performed for two main reasons: honest ones such as failure analysis, fault isolation, trustworthiness verification, etc. to dishonest ones such as cloning, counterfeiting, development of attacks, etc. Destructive methods on PCBs were considered the most common technique,, but the advent of advanced characterization and imaging tools such as X-ray tomography has shifted the reverse engineering toward non-destructive reverse engineering. Such technique considerably lowers the associated time and cost to reverse engineer a PCB. Therefore, here we introduce a new Anti-reverse engineering method to protect PCBs from non-destructive reverse engineering. We will use advanced algorithms to print or implement high Z materials inside PCBs, which creates inevitable imaging artifacts during tomography and makes it almost impossible to extract the correct information.