Non-destructive Bond Pull and Ball Shear Failure Analysis Based on Real Structural Properties
Non-destructive Bond Pull and Ball Shear Failure Analysis Based on Real Structural Properties
Thursday, November 10, 2016: 10:40 AM
108 (Fort Worth Convention Center)
Summary:
Bond pull testing is a well-known method in the failure analysis community to evaluate the integrity of an electronic microchip or detect counterfeits. Such techniques require the microchip to be de-capsulated in order to give the access for the tools and perform the test. In addition many researchers investigate the bond pull analysis based on simulation and finite element methods, where the original model is based on a CAD design for the bond wire and is far from the real geometry of the original wire. In this work, we are introducing X-ray tomography imaging with 700nm imaging resolution to acquire the 3D geometry details of bond wires non-destructively. Such information can be used to develop accurate models for finite element analysis based on real size and structure. Therefore, one can test the bond wire strength as a proof of concept for virtual mechanical testing in microchips.
Bond pull testing is a well-known method in the failure analysis community to evaluate the integrity of an electronic microchip or detect counterfeits. Such techniques require the microchip to be de-capsulated in order to give the access for the tools and perform the test. In addition many researchers investigate the bond pull analysis based on simulation and finite element methods, where the original model is based on a CAD design for the bond wire and is far from the real geometry of the original wire. In this work, we are introducing X-ray tomography imaging with 700nm imaging resolution to acquire the 3D geometry details of bond wires non-destructively. Such information can be used to develop accurate models for finite element analysis based on real size and structure. Therefore, one can test the bond wire strength as a proof of concept for virtual mechanical testing in microchips.