Enabling Electro-Optical Failure-Analysis within Extreme Compression Test Architecture

Wednesday, November 9, 2016
Dr. Rudolf Schlangen , NVIDIA Corporation, Santa Clara, CA

Summary:

In addition to the ever shrinking technology dimensions and the resulting need for better optical resolution, EFA also needs to keep up with innovations in test-architecture. Driven by the need for much higher test-compression, Nvidia recently changed its DFT architecture to “Extreme-Compression” (XTR) with on-chip pattern generation, MISR based compression of the chain output data and chiplet-based multi-port test pattern release, drastically changing the requirements for test-loop setups necessary to enable the most established EFA techniques such as LVP and SDL (aka DLS, LADA). This paper discusses test-loop requirements in general and gives Advantest 93k specific guidelines on test-pattern release and ATE setup, necessary to enabling all EFA techniques that we’ve been relying on before XTR.