Emerging FA Techniques and Concepts - Poster

Wednesday, November 9, 2016: 1:30 PM-3:30 PM
Chairs:  Jeffrey Lam, Technology Development, Chartered Semiconductor Manufacturing Pte. Ltd., Singapore, Singapore
Co-chairs:  Mr. Dan Bodoh, Product Diagnostic Center, NXP Semiconductors, Austin, TX
Enabling Electro-Optical Failure-Analysis within Extreme Compression Test Architecture
Dr. Rudolf Schlangen, NVIDIA Corporation
A Study on a Low Cost Thin Film Anti-Reflection Coating (ARC) Solution for Failure Analysis Applications
Mr. Fritz Christian Awitan, Maxim Integrated - Philippines; Ms. Camille Joyce Garcia, Maxim Integrated - Philippines; Dirk Andrew Doyle, Maxim Integrated - Hillsboro; Lawrence Benedict, Maxim Integrated - Hillsboro
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