Failure Analysis Methodology on Systematic Polar failing pattern due to higher Solder Bump Resistance issue in RF SOI device
Monday, November 7, 2016: 2:25 PM
108 (Fort Worth Convention Center)
Mr. Ang Ghim Boon
,
GLOBALFOUNDRIES Singapore Pte Ltd, Singapore, Singapore
Dr. Changqing Chen
,
Globalfoundries Singapore, Singapore, Singapore
Ng Hui Peng
,
GLOBALFOUNDRIES Singapore Pte Ltd, Singapore, Singapore
Quah Alfred
,
GLOBALFOUNDRIES Singapore Pte Ltd, Singapore, Singapore
Mr. Dayanand Nagalingam
,
GLOBALFOUNDRIES Singapore Pte Ltd, Singapore, Singapore
Ms. Angela Teo
,
GLOBALFOUNDRIES Singapore Pte Ltd, Singapore, Singapore
Teo Hanwei
,
GLOBALFOUNDRIES Singapore Pte Ltd, Singapore, Singapore
Mai Zhihong
,
GLOBALFOUNDRIES Singapore Pte Ltd, Singapore, Singapore
Dr. Jeffrey C. Lam
,
GLOBALFOUNDRIES Singapore Pte Ltd, Singapore, Singapore
