MEMS Failure Analysis In Wafer Fabrication

Wednesday, November 9, 2016
Ms. Ng Hui Peng , GLOBALFOUNDRIES Singapore Pte Ltd, Singapore, Singapore
Mr. Ang Ghim Boon , GLOBALFOUNDRIES Singapore Pte Ltd, Singapore, Singapore
Ms. Angela Teo , GLOBALFOUNDRIES Singapore Pte Ltd, Singapore, Singapore
Quah Alfred , GLOBALFOUNDRIES Singapore Pte Ltd, Singapore, Singapore
Mr. Dayanand Nagalingam , GLOBALFOUNDRIES Singapore Pte Ltd, Singapore, Singapore
Dr. Xu Nai Yun , GLOBALFOUNDRIES Singapore Pte Ltd, Singapore, Singapore
Dr. Chen Changqing , GLOBALFOUNDRIES Singapore Pte Ltd, Singapore, Singapore
Dr. Mai Zhi Hong , GLOBALFOUNDRIES Singapore Pte Ltd, Singapore, Singapore
Dr. Jeffrey C. Lam , GLOBALFOUNDRIES Singapore Pte Ltd, Singapore, Singapore

Summary:

This paper discussed how failure analysis takes into place to identify failure on MEMS device neither on MEMS cap or CMOS chip. Challenges faced and how to resolve the problem especially to identify particle contamination for MEMS.