42nd International Symposium for Testing and Failure Analysis (November 6-10, 2016): ESREF Best Paper - Unusual defects generated by wafer sawing: an update, including pick & place processing, Peter Jacob, EMPA, Switzerland

ESREF Best Paper - Unusual defects generated by wafer sawing: an update, including pick & place processing, Peter Jacob, EMPA, Switzerland

Monday, November 7, 2016: 8:45 AM

121AB (Fort Worth Convention Center)

See more of: Introduction - Opening Session
See more of: Technical Program